SF32 Naming Convention¶

Chip Naming¶

Part Number: SF32LB5xyZxYx6¶

Syntax Note

Lowercase x denotes a numeric digit.
Uppercase Y or Z denotes an alphabetic character.

Prefix: SF32LB5xy¶

SF32 — SiFli 32-bit MCU Series
LB — Product Line Identifier
- LB: Low-power Bluetooth MCU series
5 — Processor Family
- 5: Devices based on a 32-bit Arm Cortex-M33 Star-MC1 processor, or a RISC-V processor with comparable performance
x — Product Tier
- 8: Flagship (dual application processors, single low-power processor)
- 6 / 5: Mid-range (single application processor, single low-power processor)
- 2: Cost-optimized (single application processor, dedicated low-power Bluetooth controller)
y — Device Variant
- Indicates integrated PSRAM capacity (specific numbering matrix varies by product sub-family)

Suffix: ZxYx6¶

Z — Package Type
- U: QFN68
- V: BGA
- Y: QFN80
xYx — Integrated Memory Configuration (QSPI-NOR Flash & PSRAM) (Note: Exact encoding mapping depends on the specific package and device family)

Part Number Suffix Field Definitions

Field	Type	Options	Description
x	Numeric	1 to 7	Integrated QSPI-NOR Flash capacity: • 1: 2 Mb • 2: 4 Mb • 3: 8 Mb • 4: 16 Mb • 5: 32 Mb • 6: 64 Mb • 7: 128 Mb
Y	Alphabetic	A to F	Integrated PSRAM capacity & interface: • A: 16 Mb QPI-PSRAM • B: 32 Mb OPI-PSRAM • C: 64 Mb OPI-PSRAM • D: 128 Mb OPI/HPI-PSRAM • E: 256 Mb HPI-PSRAM • F: 512 Mb HPI-PSRAM

6 — Operating Temperature Grade
- 5: −20°C to +70°C (Commercial)
- 6: −40°C to +85°C (Industrial)
- 7: −40°C to +105°C (Extended Industrial Grade)

Part Number Examples¶

Example 1: SF32LB527UD6¶

SF32LB52 Series Cost-Optimized MCU configuration features:

Core Architecture: Single application processor and a dedicated low-power Bluetooth controller processor (Arm Cortex-M33 Star-MC1 based).
Package Type: QFN68 package (U).
Memory Configuration: Integrated 128 Mb OPI-PSRAM (D).
Operating Temperature: −40°C to +85°C (6, Industrial Grade).

Example 2: SF32LB587VEE56¶

SF32LB58 Series Flagship MCU configuration features:

Core Architecture: Dual application processors and one low-power processor (Arm Cortex-M33 Star-MC1 based).
Package Type: BGA256 package (V).
Memory Configuration: Integrated dual (2x) 256 Mb HPI-PSRAM (E) and one 32 Mb QSPI-NOR Flash (5).
Operating Temperature: −40°C to +85°C (6, Industrial Grade).

Module Naming¶

Part Number: SF32LB5x-MOD-y-AaaaBbbbCccc¶

Syntax Note

In the generic suffix, A, B, and C identify the three storage-field positions; they are not literal characters in every module name.
The first character within each populated field identifies the storage type. The remaining digits identify its capacity or configuration.
The -y subtype field is currently used only by the SF32LB52 module family. Published SF32LB56-MOD and SF32LB58-MOD names are not using it.

Prefix: SF32LB5x-MOD-y¶

SF32LB5x — Module MCU family
- SF32, LB, and 5 follow the same series, product-line, and processor-family meanings as the chip naming convention above.
- x identifies the product tier: 8 flagship, 6 / 5 mid-range, and 2 cost-optimized.
MOD — SiFli module product.
y — Module subtype, when the family defines one
- 1: Direct Li-ion battery operation for SF32LB520/3/5/7 devices. The chip supply range is 3.2–4.7 V; the standard configuration uses SF32LB525UC6 with 8 MB OPI-PSRAM.
- A: Regular 3.3 V operation for the SF32LB52B family. It does not support direct Li-ion battery supply; the chip supply range is 2.97–3.63 V. The standard configuration uses SF32LB52BU36 with integrated 1 MB QSPI-NOR Flash.
- B: Regular 3.3 V operation for the SF32LB52E/G/J family. It does not support direct Li-ion battery supply; the chip supply range is 2.97–3.63 V. The standard configuration uses SF32LB52EUB6 with integrated 4 MB OPI-PSRAM.

The -A module does not mount an external NOR Flash device. It can connect an external NOR Flash or SDIO peripherals, including Wi-Fi, SD-NAND, and eMMC in 4-bit mode.

Suffix: AaaaBbbbCccc¶

Module Part Number Suffix Field Definitions

Field	Storage-type code	Capacity, configuration, and suffix
`Aaaa` Variable Flash	`N`: QSPI-NOR Flash `A`: SPI-NAND Flash `D`: SD-NAND Flash `E`: eMMC	`N16`: 16 MB QSPI-NOR Flash `A128`: 128 MB SPI-NAND Flash `D128`: 128 MB SD-NAND Flash `E4`: 4 GB eMMC
`Bbbb` PSRAM	`R`: PSRAM	`R4`: 4 MB OPI-PSRAM `R8`: 8 MB OPI-PSRAM `R12`: 4 MB + 8 MB OPI-PSRAM `R16`: 16 MB OPI/HPI-PSRAM `R32`: 16 MB + 16 MB HPI-PSRAM `R64`: 32 MB + 32 MB HPI-PSRAM
`Cccc` Standard Flash	`N`: QSPI-NOR Flash	`N1`: 1 MB QSPI-NOR Flash `N4`: 4 MB QSPI-NOR Flash

The three suffix fields are concatenated without separators. Aaaa is the variable Flash option, Bbbb is the PSRAM option, and Cccc is the standard Flash option. The source guide defines the listed type-and-capacity combinations; do not assume that every type code can be combined with every capacity code. A field appears only when the documented module configuration uses it.

Part Number Examples¶

Example 1: SF32LB52-MOD-1-N16R8¶

SF32LB52 lithium-battery module configuration:

Module Subtype: -1 supports direct Li-ion battery operation with a 3.2–4.7 V chip supply.
Variable Flash: N16 indicates 16 MB QSPI-NOR Flash.
PSRAM: R8 indicates 8 MB OPI-PSRAM.

Example 2: SF32LB58-MOD-A128R32N1¶

SF32LB58 flagship module configuration:

Module Subtype: No -y subtype is used for published SF32LB58-MOD names.
Variable Flash: A128 indicates 128 MB SPI-NAND Flash.
PSRAM: R32 indicates 16 MB + 16 MB HPI-PSRAM.
Standard Flash: N1 indicates 1 MB QSPI-NOR Flash.

The naming pattern describes a configuration, not a guarantee that every code combination is a released SKU. The SiFli guide identifies SF32LB566VCB36 and SF32LB586VDD36 as standard MCU configurations for the SF32LB56-MOD and SF32LB58-MOD families respectively; additional module configurations may be customized. Confirm availability, fitted MCU, pinout, and electrical specifications in the applicable module documentation.

SiFli Chip Model Guide · SiFli Module Model Guide