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SF32LB58-MOD

Overview

SF32LB58-MOD is a flagship Bluetooth MCU module built around SiFli's SF32LB58x family. It packages the SF32LB58x-class triple-core platform, RF path, crystal, and high-memory module options into a ready-to-integrate 24 × 24 × 3.1mm module for products that need stronger graphics, larger storage, and richer display/audio capability than lower-tier designs.

Compared with a chip-down SF32LB58x board, the module lowers BGA256 layout risk, RF certification risk, crystal-integration risk, and high-speed memory-routing complexity. It is a strong fit when a project wants SF32LB58x-class UI, storage, and connectivity without absorbing the full bring-up burden of a chip-level flagship design on the first board revision.

Depending on the selected module SKU, the platform can combine HPI-PSRAM with QSPI-NOR, QSPI-NAND, or eMMC storage. The exposed interface makes the module suitable for rich display, audio, storage, and connected-control products that still prefer MCU-style integration and power behavior.

Info

For the underlying chip family, architecture, and peripheral set, see SF32LB58x. This page focuses on module-specific integration, memory variants, power rails, and product-fit decisions.

Applications

SF32LB58-MOD is recommended for products that need flagship SF32LB58x graphics, connectivity, and storage capability with reduced RF, BGA, and layout risk, including:

  • Premium smartwatches and sports watches
  • High-resolution graphical HMI panels and dashboards
  • Industrial control centers and connected instruments
  • Smart-home devices and connected appliances
  • Vehicle accessory controllers and rich UI terminals
  • Edge-AI or sensor-fusion products with larger local memory demands

Choose SF32LB58-MOD when the project wants one or more of these advantages:

  • Faster integration than a chip-down BGA256 design
  • Lower RF and antenna implementation risk
  • Easier memory-capacity selection through module SKUs
  • Better fit for products that need richer display, storage, and multimedia capability in an MCU-class platform

Development Resources


Features and Specifications

Compute and Memory

  • 2x Arm Cortex-M33 STAR-MC1 application cores, up to 240MHz
  • 1x user-programmable Arm Cortex-M33 STAR-MC1 low-power core, up to 96MHz
  • Up to 370 DMIPS / 984 EEMBC CoreMark per application core
  • Up to 148 DMIPS / 394 EEMBC CoreMark on the low-power core
  • 2176KB SRAM (HCPU) + 512KB SRAM (ACPU) + 1056KB retention SRAM (LCPU)
  • Single-precision FPU and MPU on all cores

Wireless Connectivity

  • Dual-mode Bluetooth 6.3 with BLE Audio support
  • Sensitivity down to -107.5dBm for BLE Long Range at 125kbps
  • Maximum transmit power: 19dBm (BR/BLE), 13dBm (EDR2/EDR3)
  • BR/EDR2/EDR3 peak receive current: 2.2mA @ 3.3V

Graphics, Display, and Multimedia

  • ePicasso 2.0 2D/2.5D graphics engine
  • Vivante GCNanoUltraV vector graphics engine
  • Hardware JPEG codec
  • Dual LCD controllers supporting 8080, SPI, Dual-SPI, Quad-SPI, DPI/RGB, MIPI DSI, and JDI
  • TurboPixel: extDMA fixed-ratio lossy final-framebuffer compression and display-controller decompression, reducing PSRAM bandwidth and capacity
  • Always-on-display support on both LCD controllers

Audio

  • 2x 24-bit audio DACs
  • 2x 24-bit Sigma-Delta ADCs
  • Analog audio input/output support exposed through the module interface

Storage Interfaces and Module Variants

SF32LB58-MOD Module Variants
Module Code Flash PSRAM Backup Flash Temperature Dimensions
SF32LB58-MOD-N16R16N1 16MB QSPI-NOR 8+8MB HPI-PSRAM 1MB QSPI-NOR -40 to 85°C 24 × 24 × 3.1mm
SF32LB58-MOD-N16R32N1 16MB QSPI-NOR 16+16MB HPI-PSRAM 1MB QSPI-NOR -40 to 85°C 24 × 24 × 3.1mm
SF32LB58-MOD-N16R64N4 16MB QSPI-NOR 32+32MB HPI-PSRAM 4MB QSPI-NOR -40 to 85°C 24 × 24 × 3.1mm
SF32LB58-MOD-A128R32N1 128MB QSPI-NAND 16+16MB HPI-PSRAM 1MB QSPI-NOR -40 to 85°C 24 × 24 × 3.1mm

Variant-selection guidance:

  • Choose the NOR variant for smaller and simpler storage needs
  • Choose the NAND variant when larger local asset/code storage is needed at similar density
  • Choose the eMMC variant when the design needs the largest local-storage headroom

Power, Package, and I/O

  • Module package: 24 × 24 × 3.1mm
  • Operating temperature: -40 to 85°C
  • VDD_3V3: 2.97–3.6V
  • VDD_1V8: 1.7–1.95V
  • VDDIOA / VDDIOA2 / VDDIOB: 1.7–3.6V
  • Up to 138 module pins for GPIO, SPI, LCD, MPI, UART, I2C, PWM, SDIO, USB2.0 HS, and analog audio functions

Chip

Built on SF32LB58x. Use the chip page for the broader graphics, memory, and display architecture behind the module.

Development Kits

The SF32LB58-DevKit-LCD board is a practical starting point for firmware validation, display bring-up, and audio/storage-path checks before moving to a custom carrier design around the module.

Reference Products

Typical end products include premium wearables, high-resolution dashboards, connected industrial HMI panels, and edge-AI devices that need the strongest memory and display options in the SF32LB5xx range.