SF32LB52-MOD-1¶

Overview¶

SF32LB52-MOD-1 is a low-power Bluetooth MCU module built around SiFli's SF32LB525UC6. It packages the SF32LB52x-class dual-core Arm Cortex-M33 STAR-MC1 platform, RF path, 48MHz crystal, and module-level antenna implementation into a ready-to-integrate 27.9 × 18.0 × 3.1mm form factor.

Compared with a chip-down SF32LB52x design, the module reduces RF layout, antenna matching, crystal placement, and certification risk. It is a practical choice for products that want SF32LB52x-class Bluetooth, graphics, and audio capability without taking on chip-level RF work at the first hardware spin.

Depending on the selected order code, the module can also include in-package OPI-PSRAM. The exposed module interface gives access to the same broad product-building blocks as the underlying chip family, including GPIO, SPI, LCD, MPI, UART, I2C, PWM, SDIO, USB2.0 FS, and analog audio paths.

Applications¶

SF32LB52-MOD-1 is recommended for products that need Bluetooth, graphics, and audio capability with lower RF and layout risk, including:

• Smartwatches, fitness bands, and wearable medical products
• Bluetooth sensor hubs and connected accessories
• Smart locks, smart-home devices, and compact appliances
• Small graphical HMI products
• Vehicle key fobs and wearable remote products
• Cost-sensitive connected display devices

Choose SF32LB52-MOD-1 when the project wants one or more of these advantages:

• Faster hardware bring-up than a chip-down RF design
• Lower antenna-matching and certification risk
• Reuse of SF32LB52x software and peripheral capability
• Compact module integration for space-constrained wearable or HMI products

Development Resources¶

Features and Specifications¶

Compute and Memory¶

• Arm Cortex-M33 STAR-MC1 application core (HCPU), up to 240MHz, up to 370 DMIPS / 984 EEMBC CoreMark
• 32KB + 16KB I/D-cache
• 512KB SRAM
• Dedicated ultra-low-power Arm Cortex-M33 STAR-MC1 core (LCPU), up to 24MHz, with 64KB SRAM
• Single-precision FPU and MPU on both cores
• Optional in-package OPI-PSRAM depending on module SKU

Wireless Connectivity¶

• Dual-mode Bluetooth 6.3 with BLE Audio support
• Sensitivity: -100dBm (BLE/1Mbps), -96.3dBm (BR), -95.5dBm (EDR2)
• Maximum transmit power: 19dBm (BR/BLE), 13dBm (EDR2/EDR3)
• BR peak receive current: 2.4mA @ 3.8V

Graphics and Display¶

• ePicasso 2.0 2D/2.5D graphics engine
• eZip 2.0 lossless graphics decompression accelerator
• LCD controller supporting 8080, SPI, Dual-SPI, and Quad-SPI interfaces
• Practical fit for compact watch-style or small-HMI display products

Audio¶

• 1x 24-bit audio DAC
• 1x 24-bit Sigma-Delta audio ADC
• Analog audio input/output support exposed through the module interface

Storage Interfaces¶

• Optional in-package OPI-PSRAM, depending on module SKU
• 1x MPI (QSPI) for external NOR, NAND, or OPI-PSRAM
• 1x SD/SDIO supporting SD3.0, SDIO3.0, and eMMC

Security¶

• AES, HASH, and CRC hardware accelerators
• True random number generator (TRNG)
• PSA Certified Level 1

Power, Package, and I/O¶

• Module package: 27.9 × 18.0 × 3.1mm
• Operating temperature: -40 to 85°C
• VSYS: 3.2–4.7V from Li-ion/Li-Po battery, or 3.7–4.7V from regulated supply
• IO voltage: 3.3V
• VBATS input for battery-voltage sensing
• VDD33_VOUT2 on-module 3.3V output for external peripheral supply
• Up to 68 module pins for GPIO, SPI, LCD, MPI, UART, I2C, PWM, SDIO, USB2.0 FS, and analog audio functions

Module Variants¶

Related Products¶

Chip¶

Built on SF32LB52x, specifically the SF32LB525UC6 platform. Use the chip page when you need the full architecture, peripheral, and family-variant picture behind the module.

Development Kits¶

The SF32LB52-DevKit-LCD, SF32LB52-DevKit-Core-3p3, SF32LB52-DevKit-Nano, and SF32LB52-DevKit-ULP are practical starting points for firmware validation before moving to a custom module carrier design.

Reference Products¶

Typical end products include entry-to-mid-tier smartwatches, fitness bands, Bluetooth sensor hubs, smart locks, and compact graphical HMI devices.