SF32LB56-MOD¶
Overview¶
SF32LB56-MOD is SiFli's general-purpose low-power Bluetooth MCU module family based on the SF32LB56xV platform. It combines dual-core MCU processing, Bluetooth 6.3 with BLE Audio support, graphics acceleration, audio interfaces, external-memory options, and module-level RF integration in one production-ready form factor.
Compared with a chip-down SF32LB56xV design, the module reduces RF layout, antenna matching, crystal placement, and high-speed memory integration risk. It is a strong fit for products that need more display, audio, sensing, and local-processing headroom than a simple Bluetooth module can provide, while still keeping the hardware path compact and production-friendly.
According to the module technical specification, the family is offered in multiple memory configurations, all in an 18.0 × 32.9 × 3.1mm package rated for -40 to 85°C operation. Depending on the selected SKU, the RF path uses either an on-board PCB antenna or an external antenna through an IPEX-compatible connector.
Info
For the underlying chip family, architecture, and peripheral set, see SF32LB56x. This page focuses on module-specific integration, memory variants, power rails, and product fit.
Applications¶
SF32LB56-MOD is recommended for products that need Bluetooth, display, audio, sensing, and local intelligence in a compact module form factor, including:
- Higher-end smartwatches, smart bands, and wearable medical devices
- Smart-home controllers and control panels
- Voice-command and audio-enabled products
- E-bike dashboards and vehicle accessories
- Smart locks, connected appliances, and graphical HMI panels
- Industrial sensor centers, monitoring terminals, and compact instruments
Choose SF32LB56-MOD when the project wants one or more of these advantages:
- Faster integration than a chip-down SF32LB56xV board
- Lower RF and antenna risk
- Easier memory-configuration selection by module SKU
- Better fit for products that need more UI, audio, and storage flexibility than entry-level modules
Development Resources¶
Features and Specifications¶
Compute and Memory¶
- HCPU: Arm Cortex-M33 STAR-MC1, up to 240MHz, up to 370 DMIPS / 984 EEMBC CoreMark
- LCPU: Arm Cortex-M33 STAR-MC1, up to 96MHz, up to 148 DMIPS / 394 EEMBC CoreMark
- HCPU memory system: 32KB + 16KB I/D-cache and 800KB SRAM, including 128KB retention SRAM
- LCPU memory system: 16KB + 8KB I/D-cache and 160KB retention SRAM
- Single-precision FPU and MPU on both cores
- Neural-network matrix accelerator and signal-processing accelerators for richer local workloads
Wireless Connectivity¶
- Dual-mode Bluetooth 6.3 with BLE Audio support
- Sensitivity: -100dBm BLE 1Mbps, -96.3dBm BR, -95.5dBm EDR2, -88.5dBm EDR3
- Maximum transmit power: 19dBm for BR/BLE, 13dBm for EDR2/EDR3
- BR peak receive current: 2.2mA at 3.3V
Graphics and Display¶
- ePicasso 2.0 2D/2.5D graphics engine
- Hardware rotation, scaling, mirroring, and alpha blending
- Graphics workloads up to 1024 × 1024
- eZip 2.0 lossless graphics decompression and eZip-A animation support
- LCD support for 8080, SPI, Dual-SPI, Quad-SPI, DPI/RGB, and JDI
- TurboPixel: extDMA fixed-ratio lossy final-framebuffer compression and display-controller decompression, reducing PSRAM bandwidth and capacity
Audio¶
- 1x 24-bit audio DAC
- 1x 24-bit Sigma-Delta audio ADC
- 2x PDM digital microphone inputs
- 1x I2S interface
- Audio sample-rate conversion and EQ acceleration
Memory and Module Variants¶
| Module Code | Main Flash | PSRAM | Backup Flash | Temperature | Dimensions |
|---|---|---|---|---|---|
| SF32LB56-MOD-N16R12N1 | 16MB QSPI-NOR | 4+8MB OPI-PSRAM | 1MB QSPI-NOR | -40 to 85°C | 18.0 × 32.9 × 3.1mm |
| SF32LB56-MOD-A128R12N1 | 128MB QSPI-NAND | 4+8MB OPI-PSRAM | 1MB QSPI-NOR | -40 to 85°C | 18.0 × 32.9 × 3.1mm |
| SF32LB56-MOD-D128R12N1 | 128MB SD-NAND | 4+8MB OPI-PSRAM | 1MB QSPI-NOR | -40 to 85°C | 18.0 × 32.9 × 3.1mm |
Power and I/O¶
- VDD_3V3 recommended operating range: 2.97–3.6V
- VDD_1V8 recommended operating range: 1.7–1.95V
- VDDIO recommended operating range: 1.7–3.6V
- VDD_3V3, VDD_1V8, and VDDIO must power up together
- PA00–PA11 interface level is fixed at 3.3V and does not follow VDDIO
- 89-pin module interface
- Operating temperature: -40 to 85°C
Related Products¶
Chip¶
Built on SF32LB56x, specifically the SF32LB56xV platform family. Use the chip page for the broader architecture, display, audio, and package context behind the module.
Development Kits¶
Use the selected SF32LB56x bring-up platform together with the module SKU and intended software image, because memory type and antenna configuration affect firmware layout, RF verification, and production test planning.
Reference Products¶
Typical end products include higher-end smartwatches, connected HMI panels, smart-home controllers, voice-capable accessories, industrial monitoring terminals, and Bluetooth sensor hubs.