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SF32 Naming Convention

Part Number: SF32LB5xyZxYx6

Syntax Note

  • Lowercase x denotes a numeric digit.
  • Uppercase Y or Z denotes an alphabetic character.

Prefix: SF32LB5xy

  • SF32 — SiFli 32-bit MCU Series
  • LB — Product Line Identifier
    • LB: Low-power Bluetooth MCU series
  • 5 — Processor Family
    • 5: Devices based on a 32-bit Arm Cortex-M33 Star-MC1 processor, or a RISC-V processor with comparable performance
  • x — Product Tier
    • 8: Flagship (dual application processors, single low-power processor)
    • 6 / 5: Mid-range (single application processor, single low-power processor)
    • 2: Cost-optimized (single application processor, dedicated low-power Bluetooth controller)
  • y — Device Variant
    • Indicates integrated PSRAM capacity (specific numbering matrix varies by product sub-family)

Suffix: ZxYx6

  • Z — Package Type
    • U: QFN68
    • V: BGA
    • Y: QFN80
  • xYx — Integrated Memory Configuration (QSPI-NOR Flash & PSRAM) (Note: Exact encoding mapping depends on the specific package and device family)
Part Number Suffix Field Definitions
Field Type Options Description
x Numeric 1 to 7 Integrated QSPI-NOR Flash capacity:
• 1: 2 Mb
• 2: 4 Mb
• 3: 8 Mb
• 4: 16 Mb
• 5: 32 Mb
• 6: 64 Mb
• 7: 128 Mb
Y Alphabetic A to F Integrated PSRAM capacity & interface:
• A: 16 Mb QPI-PSRAM
• B: 32 Mb OPI-PSRAM
• C: 64 Mb OPI-PSRAM
• D: 128 Mb OPI/HPI-PSRAM
• E: 256 Mb HPI-PSRAM
• F: 512 Mb HPI-PSRAM
  • 6 — Operating Temperature Grade
    • 5: −20°C to +70°C (Commercial)
    • 6: −40°C to +85°C (Industrial)
    • 7: −40°C to +105°C (Extended Industrial Grade)

Part Number Examples

Example 1: SF32LB527UD6

SF32LB52 Series Cost-Optimized MCU configuration features:

  • Core Architecture: Single application processor and a dedicated low-power Bluetooth controller processor (Arm Cortex-M33 Star-MC1 based).
  • Package Type: QFN68 package (U).
  • Memory Configuration: Integrated 128 Mb OPI-PSRAM (D).
  • Operating Temperature: −40°C to +85°C (6, Industrial Grade).

Example 2: SF32LB587VEE56

SF32LB58 Series Flagship MCU configuration features:

  • Core Architecture: Dual application processors and one low-power processor (Arm Cortex-M33 Star-MC1 based).
  • Package Type: BGA256 package (V).
  • Memory Configuration: Integrated dual (2x) 256 Mb HPI-PSRAM (E) and one 32 Mb QSPI-NOR Flash (5).
  • Operating Temperature: −40°C to +85°C (6, Industrial Grade).